JPH0340536Y2 - - Google Patents
Info
- Publication number
- JPH0340536Y2 JPH0340536Y2 JP1983136220U JP13622083U JPH0340536Y2 JP H0340536 Y2 JPH0340536 Y2 JP H0340536Y2 JP 1983136220 U JP1983136220 U JP 1983136220U JP 13622083 U JP13622083 U JP 13622083U JP H0340536 Y2 JPH0340536 Y2 JP H0340536Y2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- wafer
- plate
- fixing plate
- polishing liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005498 polishing Methods 0.000 claims description 79
- 239000007788 liquid Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 45
- 239000004744 fabric Substances 0.000 description 8
- 239000006061 abrasive grain Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 4
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983136220U JPS6045652U (ja) | 1983-09-02 | 1983-09-02 | ポリシング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983136220U JPS6045652U (ja) | 1983-09-02 | 1983-09-02 | ポリシング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6045652U JPS6045652U (ja) | 1985-03-30 |
| JPH0340536Y2 true JPH0340536Y2 (en]) | 1991-08-26 |
Family
ID=30306355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983136220U Granted JPS6045652U (ja) | 1983-09-02 | 1983-09-02 | ポリシング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6045652U (en]) |
-
1983
- 1983-09-02 JP JP1983136220U patent/JPS6045652U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6045652U (ja) | 1985-03-30 |
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